崗位職責(zé)：
1.跟蹤客戶，提供技術(shù)支持，解決客戶在應(yīng)用中遇到的問(wèn)題.
2.了解客戶的需要，并適當(dāng)?shù)馗鶕?jù)客戶的需要進(jìn)行應(yīng)用設(shè)計(jì).
3.不斷的進(jìn)行對(duì)產(chǎn)品的了解及相關(guān)技術(shù)的學(xué)習(xí).
4.了解市場(chǎng)的動(dòng)向，及競(jìng)爭(zhēng)對(duì)手對(duì)于產(chǎn)品的信息.
5.配合公司內(nèi)市場(chǎng)人員提供市場(chǎng)推廣技術(shù)支持.
Job Description：
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5.ooperating with marketing specialist to promote company’s new products to market.
任職要求：
1.電子工程或相關(guān)專業(yè)本科及以上學(xué)歷.
2.了解基于ARM處理器的SOC架構(gòu)，熟悉高速總線，DDR，PCIe控制器，GMII/SGMII,MIPI以及各種標(biāo)準(zhǔn)低速外設(shè)接口。
3.三年以上高速數(shù)字電路系統(tǒng)集成設(shè)計(jì)開(kāi)發(fā)經(jīng)驗(yàn)，熟練使用2種以上EDA原理圖設(shè)計(jì)工具。
4.熟悉電路板性能和功耗評(píng)估以及熱效率分析。
5.具備配合BSP軟件工程師定位調(diào)試問(wèn)題能力
6.具備良好的問(wèn)題分析能力，溝通能力和團(tuán)隊(duì)合作意識(shí),車載電子行業(yè)工作經(jīng)驗(yàn)者優(yōu)先。
Job requirements：
1.Bachelor’s degree or above on electronic engineering or similar major background.
2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
4.Having knowledge on board level performance/power consumption/thermal analysis.
5.Having capability of trouble shooting with BSP software engineer together.
6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.
1.跟蹤客戶，提供技術(shù)支持，解決客戶在應(yīng)用中遇到的問(wèn)題.
2.了解客戶的需要，并適當(dāng)?shù)馗鶕?jù)客戶的需要進(jìn)行應(yīng)用設(shè)計(jì).
3.不斷的進(jìn)行對(duì)產(chǎn)品的了解及相關(guān)技術(shù)的學(xué)習(xí).
4.了解市場(chǎng)的動(dòng)向，及競(jìng)爭(zhēng)對(duì)手對(duì)于產(chǎn)品的信息.
5.配合公司內(nèi)市場(chǎng)人員提供市場(chǎng)推廣技術(shù)支持.
Job Description：
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5.ooperating with marketing specialist to promote company’s new products to market.
任職要求：
1.電子工程或相關(guān)專業(yè)本科及以上學(xué)歷.
2.了解基于ARM處理器的SOC架構(gòu)，熟悉高速總線，DDR，PCIe控制器，GMII/SGMII,MIPI以及各種標(biāo)準(zhǔn)低速外設(shè)接口。
3.三年以上高速數(shù)字電路系統(tǒng)集成設(shè)計(jì)開(kāi)發(fā)經(jīng)驗(yàn)，熟練使用2種以上EDA原理圖設(shè)計(jì)工具。
4.熟悉電路板性能和功耗評(píng)估以及熱效率分析。
5.具備配合BSP軟件工程師定位調(diào)試問(wèn)題能力
6.具備良好的問(wèn)題分析能力，溝通能力和團(tuán)隊(duì)合作意識(shí),車載電子行業(yè)工作經(jīng)驗(yàn)者優(yōu)先。
Job requirements：
1.Bachelor’s degree or above on electronic engineering or similar major background.
2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
4.Having knowledge on board level performance/power consumption/thermal analysis.
5.Having capability of trouble shooting with BSP software engineer together.
6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.